Mfg Part Number: TIBPAL16R8-30MJB | Alternate P/N: TIBPAL16R830MJB | NSN : 5962-01-262-2718 |
NIIN : 012622718 | CAGE Code : 01295 | Manufacturer: Texas Instruments Incorporated |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
If you are in the market for NSN part like TIBPAL16R8-30MJB of Microcircuit Memory components with the NSN 5962-01-262-2718, we have you covered here on Single Source Spares. Listed alongside the part number TIBPAL16R8-30MJB, this particular NSN component was originally manufactured by Texas Instruments Incorporated. All listings are ready for purchase from our website at any time, so you can easily request a quote for your comparisons on TIBPAL16R8-30MJB part through the completion and submission of the form provided on this page. To ensure a customized solution that meets your needs, please let us know information such as your target price and expected shipping time frame. Once we have received a completed form, a dedicated account representative will rapidly formulate a quote and present it to you in just 15 minutes or less.
To ensure that customers only procure the exact items that they need, we try to list our parts with all of their applicable information. For example, TIBPAL16R8-30MJB part of Texas Instruments Incorporated was specifically manufactured under FSC 5962 Microcircuits Electronic and the CAGE Code 01295. Additionally, if you choose to purchase this item, it will ship with any applicable qualifying certifications or manufacturing trace documentation for your benefit. Kick-start the procurement process today and see how Single Sourcing Spares can serve as your strategic sourcing partner for all your operational needs!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-262-2718 Item Description: Microcircuit Memory | 5962 | 012622718 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Tibpal16r8-30mjb | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.200 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.310 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND BIPOLAR AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | METAL OR PLASTIC OR CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
CZER | MEMORY DEVICE TYPE | PAL |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
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